To provide a raw material for alkali-soluble photosensitive resin composition that permits easy pattern formation and has excellent high heat resistance, high reliability, for example, moisture-resistance reliability, further high transparency and low dielectric constant.
In the presence of a palladium catalyst complex and a base, a compound represented by general formula (1) (wherein R1 is H, -CO-R2 or -SO2-R2) and a compound represented by general formula (2) [wherein R1 is same as in the general formula (1)] are allowed to react with each other to produce a compound of general formula (3) (wherein n is an integer of 1 or more; R1 is H or -CO-R2 or -SO2-R2). In this case, the base has preferably pKa > 11. The alkali-soluble resin composition is prepared by allowing a compound represented by general formula (3) to react with a compound bearing two or more benzocyclobutene structures in one molecule at 100°C to 200°C with heat and its carboxyl group equivalent is ≤ 400 g/mole.
MAKABE HIROAKI
TAKEUCHI ETSU
