To provide a method for producing a carrier for an electronic part which is excellent in mechanical strength and material characteristics in particular.

The method includes a process in which a crystalline plastic material, an amorphous plastic material, and a coupling agent are mixed by a mixer to produce a necessary raw materials; a process in which the mixed raw materials are supplied to an extruder to be heated/processed, and extruded from a die to mold the semi-finished product of the carrier (10) having a prescribed thickness; a process in which the semi-finished product is rolled into a prescribed size by hot rolling; a process in which the semi-finished product is molded into a prescribed shape; a process in which the molded semi-finished product is wound; and a process in which the wound carrier (10) is fed to be subjected to punching by a punching machine to form a row of positioning holes (11) arranged at prescribed intervals, and at least a row of electronic part mounting holes (12) arranged at prescribed intervals in a surface for mounting the electronic part.