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Title:
METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2005272874
Kind Code:
A
Abstract:

To provide a method for forming a projecting conductor bump having reduced variation in shape and height and reduced widening in the horizontal direction, by depositing the conductor bump in a short time by bottom up.

In the method for producing a circuit board where a conductor bump is formed on a conductor circuit by electroplating, the forming rate in the vertical direction of the conductor bump to the forming rate in the horizontal direction is controlled to 2 to 10 times, and further, the current density of the electroplating is gradually increased, so as to form the conductor bump.


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Inventors:
ISHIBASHI MIKIHIKO
Application Number:
JP2004084522A
Publication Date:
October 06, 2005
Filing Date:
March 23, 2004
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C25D3/38; C25D5/18; C25D7/00; C25D21/10; C25D21/12; H01L21/60; H05K3/40; (IPC1-7): C25D5/18; C25D3/38; C25D7/00; C25D21/10; C25D21/12; H01L21/60; H05K3/40
Domestic Patent References:
JPS4944942A1974-04-27
JPS5337542A1978-04-06
JPS58177488A1983-10-18
JPS57210988A1982-12-24
JP2001181895A2001-07-03
JP2000080496A2000-03-21
JP2001234396A2001-08-31
JP2002105687A2002-04-10
JP2005097732A2005-04-14
JP2005535787A2005-11-24
JP2004068088A2004-03-04
JP2003213489A2003-07-30
JPS644091A1989-01-09
JPH11100690A1999-04-13
JPH05295589A1993-11-09
JPH05243730A1993-09-21
JPH06158396A1994-06-07
Foreign References:
WO2004016829A22004-02-26



 
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