Title:
強度及び導電率に優れた銅合金板材の製造方法及びこれから製造された銅合金板材
Document Type and Number:
Japanese Patent JP7227245
Kind Code:
B2
Abstract:
Disclosed is a method of producing a copper alloy sheet material, wherein the copper alloy sheet material contains nickel (Ni) 0.5 to 1.5% by weight; cobalt (Co) 0.3 to 1.5% by weight; silicon (Si) 0.35 to 0.8% by weight; chromium (Cr) 0.05 to 0.5% by weight; a balance amount of copper (Cu); and inevitable impurities. Further, disclosed is a copper alloy sheet material produced using the method.
Inventors:
Juan, Jin
Choi, Young-chul
Cha, Jeongmin
Ju, Jangho
Choi, Young-chul
Cha, Jeongmin
Ju, Jangho
Application Number:
JP2020528037A
Publication Date:
February 21, 2023
Filing Date:
February 25, 2020
Export Citation:
Assignee:
Punsan Corporation
International Classes:
C22F1/08; B22D21/00; C22C9/06
Domestic Patent References:
| JP2018159103A | ||||
| JP2017179568A | ||||
| JP2011214088A | ||||
| JP2011017072A |
Foreign References:
| WO2011068135A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Shuwa Patent Office