To efficiently and surely obtain metal coated powder having a uniform plated layer on the whole surface and showing high electric conductivity.

This method for producing electroconductive powder coated with a metal is characterized in that powder is treated with a reducing silicon- based polymer compound, a silicon-based polymer compound layer is formed on the surface of the powder, the powder is dispersed into water in a state not to cause flocculation, then the powder is treated with a metal salt composed of a metal having ≥0.54 V standard oxidation-reduction potential to precipitate a metal colloid on the silicon-based polymer compound layer, then the powder is treated with an electroless plating solution and the metal film is deposited on the surface of the powder.