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Title:
METHOD FOR PRODUCING FLEXIBLE COPPER-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2007118391
Kind Code:
A
Abstract:

To provide a method for producing a flexible copper-clad laminate without wrinkles in one process without using an adhesive.

A pair of metallic press rolls 1a and 1b lays belt-shaped copper foil pieces 21 and 22 on the upper and lower sides of a belt-shaped polyimide resin film 31 respectively to overlap each other and heats/presses them. The copper foil pieces 21 and 22 are welded to the resin film 31 by the heat-welding of the film 31. Lower side guide roll groups 8b and 9b which guide the lower side copper foil piece 22 to lay it on the resin film 31 to overlap each other and upper side guide roll groups 8a and 9a which guide the upper side copper foil piece 21 to lay it on the resin film 31 to overlap each other are arranged on the in-sides of the press rolls 1a and 1b. The resin film 31 and the upper and lower copper foil pieces 21 and 22 are preheated by both guide roll groups and a heating furnace.


Inventors:
TADA KENICHIRO
NAKANISHI SATORU
WATANABE KENICHI
Application Number:
JP2005313633A
Publication Date:
May 17, 2007
Filing Date:
October 28, 2005
Export Citation:
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Assignee:
HITACHI ENG SERVICE
International Classes:
B29C43/46; B32B15/088; B32B37/10; B29K79/00; B29L31/34
Attorney, Agent or Firm:
Yukihiko Takada



 
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