To provide a method for producing a highly thermally conductive silicone rubber sponge composition which provides a silicone rubber cured product with high thermal conductivity and low heat capacity as well, and which is effective for a thermal fixing roll.
The method for producing a highly thermally conductive silicone rubber sponge composition which contains a hollow filler composed of an organic resin and thermally conductive powder, is a method for producing an addition reaction curing type highly thermally conductive silicone rubber sponge composition with which a highly thermally conductive silicone rubber sponge composition with a void volume rate of 10-70% is obtained by uniformly mixing (A) a liquid thermosetting organopolysiloxane composition containing the hollow filler composed of an organic resin and having viscosity of 200 Pa s or less at 25°C, which is prepared by premixing the hollow filler composed of an organic resin and an alkenyl group-containing organopolysiloxane, and (B) a liquid organopolysiloxane composition containing highly thermally conductive powder and having viscosity of 500 Pa s or less at 25°C, which is prepared by premixing thermally conductive powder whose heat conductivity being a single item is 15 W/m.K or more and an alkenyl group-containing organopolysiloxane.
TOMIZAWA NOBUMASA
JP2010092070A | 2010-04-22 | |||
JP2006265340A | 2006-10-05 | |||
JP2010256585A | 2010-11-11 | |||
JP2010092070A | 2010-04-22 | |||
JP2006265340A | 2006-10-05 | |||
JP2010256585A | 2010-11-11 |
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
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