Title:
METHOD FOR PRODUCING PLATED STRIP MATERIAL AND PLATED STRIP MATERIAL
Document Type and Number:
Japanese Patent JP2023105605
Kind Code:
A
Abstract:
To provide a method for producing a plated strip material capable of stably forming a plated layer with a uniform thickness, and to provide the plated strip material.SOLUTION: A method for producing a plated strip material in which a plating layer is formed on a surface of a strip material is provided. The method is characterized by applying, before transporting the strip material wound in a coil shape to a plating tank, a pressure of 10 MPa or more in a thickness direction of the strip material with a leveler to correct a warpage amount to 10 mm or less per 300 mm of reference length in a longitudinal direction. It is preferable to affix a masking tape to the surface of the strip material at a pressure of 1 MPa or less, and then apply a pressure of 10 MPa or more in the thickness direction of the strip material with the leveler.SELECTED DRAWING: None
Inventors:
KATO NAOKI
KUBOTA KENJI
FUJITA DAISUKE
KEMMOCHI HITOSHI
KUBOTA KENJI
FUJITA DAISUKE
KEMMOCHI HITOSHI
Application Number:
JP2022006537A
Publication Date:
July 31, 2023
Filing Date:
January 19, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
OM SANGYO KK
OM SANGYO KK
International Classes:
C25D5/02; B21D1/05; C25D7/06
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
Mitsuo Teramoto
Fumihiro Hosokawa
Onami Kazunori
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