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Title:
ポリオキシメチレン樹脂組成物の製造方法
Document Type and Number:
Japanese Patent JP5435629
Kind Code:
B2
Abstract:

To provide a polyoxymethylene resin composition which has extremely reduced release amount of formaldehyde and is excellent in shock resistance and thermal discoloration prevention.

The method of producing the polyoxymethylene resin composition comprising a polyoxymethylene resin (A), a hydrazide compound (B) and a filler (C) includes: a step of supplying the polyoxymethylene resin (A) from a main feed port of an extruder into a barrel by means of a screw having a melting zone and a kneading zone and constituted with kneading disks and melting the resin in the melting zone; and a step of, thereafter, supplying the hydrazide compound (B) and the filler (C) from a side feed port, kneading the molten resin, the hydrazide compound (B) and the filler (C) in the kneading zone and continuously extruding the kneaded compound from a die of the extruder while performing degassing from a vent port.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
Shuichi Kudo
Application Number:
JP2009166007A
Publication Date:
March 05, 2014
Filing Date:
July 14, 2009
Export Citation:
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Assignee:
Asahi Kasei Chemicals Corporation
International Classes:
B29B7/38; B29C48/57; B29B7/58; C08J3/20; C08K5/25; C08K7/00; C08L59/00; B29K59/00; B29K105/16
Domestic Patent References:
JP2008156628A
JP2007246592A
Foreign References:
WO2005033201A1
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Yoshikuni Suda



 
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