To provide a method for producing a solid state resin composition that should be called as an emulsion precursor, from which a resin emulsion is prepared without requiring special facilities, and to provide a resin emulsion having a small particle diameter comprising the above resin composition and water.
The method for producing a resin composition comprises cooling a solid state resin composition containing 100 parts by mass of a vinyl polymer having a glass transition temperature of 0 to 140C and a weight average molecular weight of 300 to 10,000, 1 to 20 parts by mass of a surfactant and 0.1 to 20 parts by mass of water, with cooling air controlled to a relative humidity of 40 to 100% down to the glass transition temperature or lower of the vinyl polymer. The vinyl polymer is preferably at least one kind selected from petroleum resin, rosin resin and terpene resin. The resin composition can be converted into a resin emulsion by mixing 40 to 10,000 parts by mass of water to 100 parts by mass of the composition. The resin emulsion can be used as a tacky adhesive, an adhesive, a coating material, ink or a coating agent.
KONISHI HIRONORI
KOBAYASHI KAZUHIRO
| JPS5420065A | 1979-02-15 | |||
| JPS5356233A | 1978-05-22 | |||
| JP2009126983A | 2009-06-11 |