Title:
METHOD OF PRODUCING WOODY BOARD AND WOODY BOARD
Document Type and Number:
Japanese Patent JP2015013442
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of producing a woody board 1 which takes the global environment into consideration and achieves both excellent strength properties and reduction of the formation time and a woody board 1 which is suppressed in occurrence of mold and has water resistance.SOLUTION: A method of producing a woody board 1 comprises arranging, at least on the surface of a core layer 2 adhered with a plant chip, a surface layer 3 adhered with another plant chip finer than the plant chip of the core layer 2 or a plant fiber and adhering the surface layer with an adhesive. A petroleum-originated adhesive is used as the adhesive for adhering the plant chip of the core layer 2, and a plant-originated adhesive is used as the adhesive for adhering the plant chip or the fiber of the surface layer 3.
Inventors:
MAEDA NAOHIKO
SUGAWARA AKIRA
ASADA TEPPEI
MORI KENJI
SUGAWARA AKIRA
ASADA TEPPEI
MORI KENJI
Application Number:
JP2013142100A
Publication Date:
January 22, 2015
Filing Date:
July 05, 2013
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
B27N3/00; B27K5/00; C09J103/00; C09J161/24; C09J161/28; C09J193/00; C09J195/00
Domestic Patent References:
| JP2005125737A | 2005-05-19 | |||
| JP2013014040A | 2013-01-24 | |||
| JPS57152944A | 1982-09-21 |
Foreign References:
| WO2010001988A1 | 2010-01-07 |
Attorney, Agent or Firm:
Toshio Nishizawa
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