Title:
回路基板内に電気絶縁部を設けるための方法
Document Type and Number:
Japanese Patent JP5426051
Kind Code:
B2
Abstract:
A method for introducing electrical insulations in a printed circuit board includes selectively introducing groove-shaped recesses between different regions of an electrically conductive layer on a substrate along a machining path using a thermal energy input such that end portions of each of the recesses or different ones of the recesses are joined to one another. The end portions are introduced parallel to one another without overlap such that a strip-shaped region of the conductive layer is initially retained between the end portions so as to insulate the different regions.
Inventors:
Van Aalst Yang
Application Number:
JP2013508370A
Publication Date:
February 26, 2014
Filing Date:
March 23, 2011
Export Citation:
Assignee:
LKF F Laser und Electronics Actien Gezershaft
International Classes:
H05K3/08; B23K26/00; B23K26/36; H05K3/00
Domestic Patent References:
| JP766533A | ||||
| JP4116887A | ||||
| JP766531A |
Attorney, Agent or Firm:
Mitsufumi Esaki
Blacksmith
Ryota Imamura
Kiyota Eisho
Blacksmith
Ryota Imamura
Kiyota Eisho