Title:
METHOD OF RECOGNIZING LEADS IN WIRE BONDER
Document Type and Number:
Japanese Patent JP3534637
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize a method of recognizing leads which eliminates the need for lead recognition frame used in the prior art and enables all bondable leads in a photographed image to be accurately recognized and extracted.
SOLUTION: A search range L+W/2, nearly equal to the distance between the lead spacing L and lead line width of a lead frame, is prepared in advance, a lead 21 is selected as a start point of a lead extracting process, and a bonding point P1 of the lead 21 is set as a base point to decide whether the search range L+W/2 is set within a photographed image 1. If within the image 1, the bonding point P2 of a lead 22 adjacent the lead 21 being the base point is obtained and the above steps are repeated with the bonding point P2 of the lead 22 set as a new base point, thereby extracting all bondable leads P1-P4 within the photographed image.
Inventors:
Shoji, Haruo
Application Number:
JP2641799A
Publication Date:
June 07, 2004
Filing Date:
February 03, 1999
Export Citation:
Assignee:
KAIJO CORP
International Classes:
G06T1/00; G06T7/00; H01L21/60; (IPC1-7): H01L21/60; G06T1/00
Attorney, Agent or Firm:
藤井 紘一 （外１名）
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