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Patent Searching and Data


Title:
METHOD OF RELEASING MULTI-LAYERED MOLDING
Document Type and Number:
Japanese Patent JPH04147811
Kind Code:
A
Abstract:

PURPOSE: To facilitate mold releasing and take-out of a multi-layered molding by maintaining the end peripheral part of a first material adhering to a lower mold by a clamping device, and separating a second material and an upper mold, and then releasing the sticking of the first material to the lower mold by means of the clamping device.

CONSTITUTION: A mold releasing agent 4 is used in a small quantity and applied onto an upper mold. On a lower mold 1, a semi-molded first material 3 is mounted and the four sides thereof are clamped at appropriate distances. For a clamping device 20, a manually operating spring buckle is adaptable, however, a clamping device utilizing a hydraulic cylinder 30 and a rink can also be used therefor. While keeping the clamping intact, mold clamping, the injection of the second material 6, and mold opening are effected therein. At the time of mold opening, even the welding of the second material 6 is partially performed with respect to the inner wall of an upper mold, since the adhesive forces between the first and second materials are greater than this, the second material is left on the lower mold together with the first material clamped, therefore, the operator P can remove a multi-layered molding 10 without changing his position.


Inventors:
TAKENAKA TATSUYA
TAKASHINA RYUJI
SAEKI SUSUMU
Application Number:
JP27414390A
Publication Date:
May 21, 1992
Filing Date:
October 11, 1990
Export Citation:
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Assignee:
DAIKYO INC
International Classes:
B29C39/36; B29C39/10; B29K105/04; B29L9/00; (IPC1-7): B29C39/10; B29C39/36; B29K105/04; B29L9/00
Attorney, Agent or Firm:
Yasuo Masao