Title:
METHOD OF REUSING SLURRY, AND METHOD OF MANUFACTURING SILICON WAFER
Document Type and Number:
Japanese Patent JP2015085389
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of reusing slurry which has little variation in the thickness of a base plate when slicing, and reduced the adhesion of abrasive grains to the base plate after slicing.SOLUTION: A method of reusing slurry which is supplied to a wire of a wire saw device used when slicing a workpiece and contains abrasive grains and coolant, has a first separating step S2 for separating used slurry P1 supplied to the wire into an abrasive grain part P2 mainly containing the reusable abrasive grains and the other part P3; a second separating step S3 for separating the other part P3 separated in the first separating step S2 into a coolant containing liquid P4 mainly containing reusable coolant and sludge P5; a first combining step S4 for obtaining mixture containing the abrasive grain part P2 separated in the first separating step S2, the coolant containing liquid P4 separated in the second separating step S3, and an additive agent A1 for scattering; and a second combining step S5 for mixing new abrasive grains S2 into the mixture obtained in the first combining step S4 to obtain regenerated slurry.
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Inventors:
TOMIE SHU
NISHIGUCHI KOSUKE
KURITA MASANORI
NISHIGUCHI KOSUKE
KURITA MASANORI
Application Number:
JP2013222101A
Publication Date:
May 07, 2015
Filing Date:
October 25, 2013
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
B24B57/02; B24B27/06; B28D5/04; H01L21/304