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Title:
METHOD FOR SELECTIVELY COATING ELECTRONIC COMPONENT WITH COATING MATERIAL, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2020061391
Kind Code:
A
Abstract:
To provide a method for selectively coating an electronic component with a coating material, the method being capable of collectively coating a large quantity of element bodies with the coating material.SOLUTION: The present invention relates to a method for coating, with a coating material, only a surface material selected from among multiple surface materials of different qualities exposed on a surface of an element body. The method successively includes: an element body preparation step of defining a surface material to be coated with the coating material as a selective surface material and defining a surface material not to be coated with the coating material as a non-selective surface material, and then preparing an element body (laminated capacitor 1) in which the selective surface material (a component main body 2 made of ceramic) and the non-selective surface material (external electrodes 3a and 3b made of a metal) are exposed on a surface thereof; a surface modification step of applying a surface modifying agent (a silane coupling agent 4) to only a surface of the selective surface material of the surface of the element body; and a coating step of coating the surface of the selective surface material to which the surface modifying agent is applied, with the coating material (a polymer resin 7).SELECTED DRAWING: Figure 3

Inventors:
YOSHIDA IKUSHI
FUKUTANI TATSUYA
KUNISHI TATSUO
MINODA MASAHIKO
MORI RYOTA
Application Number:
JP2016252395A
Publication Date:
April 16, 2020
Filing Date:
December 27, 2016
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
KYOTO INST TECH
International Classes:
H01G2/10; H01F41/04; H01G4/12; H01G4/224; H01G4/30; H01G13/00
Attorney, Agent or Firm:
Nao Kawamoto