Title:
METHOD OF MOUNTING/DEMOUNTING SEMICONDUCTOR WAFER AND MIXTURE SUITABLE THEREFOR
Document Type and Number:
Japanese Patent JP3032973
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an adhesive and curing water soluble mixture temperature which is dependent under dry state by providing a temperature-dependent adhesive and curing joint between a semiconductor wafer and a carrier plate, for curing the joint and removing the cured joint with water.
SOLUTION: A temperature-dependent adhesive and curing joint is provided between a semiconductor wafer and a carrier plate with the use of a mixture containing esterified colophonium resin which is modified through a reaction with a compound selected from a group of maleic acid, maleic anhydride and fumaric acid. The joint is then cured and removed with water, after a semiconductor wafer has been polished. Level difference in submicron range does not remain at all on the surface of the polished semiconductor wafer, and an adhesive and curing water soluble mixture which is temperature-dependent under dry state can be obtained.
Inventors:
Robert Lula Endle
Norbert Franze
Franz Manx
Anthony Schnecks
Norbert Franze
Franz Manx
Anthony Schnecks
Application Number:
JP30000798A
Publication Date:
April 17, 2000
Filing Date:
October 21, 1998
Export Citation:
Assignee:
Wacker Ziltronique Gezelshaft Fuer Halbreiter Materia Lien Akchen Gezelshaft
International Classes:
C09J193/00; H01L21/304; H01L21/58; H01L21/68; (IPC1-7): H01L21/304
Domestic Patent References:
| JP9157628A | ||||
| JP6294096A | ||||
| JP9291244A |
Attorney, Agent or Firm:
Tadashi Hagino (3 outside)