Title:
METHOD OF SOLDERING BASE MATERIAL
Document Type and Number:
Japanese Patent JPS60229398
Kind Code:
A
Abstract:
The invention concerns a coating composition which may be used to form a peelable solder mask. The coating composition comprises a mixture of vinylic resin, microcrystalline wax and solvent. Applied as a film coating, the coating composition can be used to provide a temporary mask to selected areas of a substrate, for example, a printed circuit, prior to exposure to a solder flux, the mask being readily peelable from the substrate.
Inventors:
FURANKU UEIN MAACHIN
FURANKU SENTO JIYON
FURANKU SENTO JIYON
Application Number:
JP7633385A
Publication Date:
November 14, 1985
Filing Date:
April 10, 1985
Export Citation:
Assignee:
ELECTRO MATERIALS
International Classes:
H05K3/28; B23K35/22; C09D5/00; C09D157/00; H05K3/00; H05K3/34; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Asamura Akira