Title:
METHOD FOR SOLDERING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH07235762
Kind Code:
A
Abstract:
PURPOSE: To provide a method for soldering a printed wiring board capable of preventing the occurrence of solder bridging without creating degrading of productivity for printed wiring boards.
CONSTITUTION: An adhesive 13 for temporary fixing a chip part 10 as a surface mount part is coated to a region where solder bridge is easy to occur on a printed wiring board 1. In this state, molten solder 16 is supplied by flow soldering and soldering is performed.
Inventors:
YAMADA KAZUHITO
Application Number:
JP2452394A
Publication Date:
September 05, 1995
Filing Date:
February 22, 1994
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/34; H05K3/00; H05K3/30; (IPC1-7): H05K3/34; H05K3/34
Attorney, Agent or Firm:
Hironobu Onda