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Patent Searching and Data


Title:
METHOD AND STRUCTURE FOR ADHESIVELY FIXING PART
Document Type and Number:
Japanese Patent JP2007063363
Kind Code:
A
Abstract:

To provide a method and a structure for adhesively fixing parts, with which a positioning operation is facilitated when two parts are adhesively fixed mutually by using a double sided adhesive tape.

Ends of adhesive surfaces 1a and 2a of a first part 1 and a second part 2 are provided with parts 1b and 2b different in level to be mutually engaged, respectively. A projected part 1c is formed on the part 1b different in level and a recessed part 2c is formed on the part 2b different in level. A nonadhesive area 4 not to be stuck with a double sided adhesive tape 3 is formed at the side of the part 1b in different level of the adhesive surface 1a, an adhesive area 5 except the nonadhesive area 4 is stuck with the double sided adhesive tape 3. The first part 1 is brought into contact from the side of the part 1b different in level of the adhesive surface 1a with the adhesive surface 2a of the second part 2, both the parts 1b and 2b different in level and the projected part 1c and the recessed part 2c are fitted and positioned while mutually sliding them. Both the adhesive surfaces 1a and 2a are fitted and adhesively fixed.


Inventors:
HASHIGUCHI JUN
NOSAKA JUN
Application Number:
JP2005249402A
Publication Date:
March 15, 2007
Filing Date:
August 30, 2005
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C09J5/00
Attorney, Agent or Firm:
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo
Keigo Murakami