Title:
METHOD AND STRUCTURE FOR BURYING MATERIAL TO BE BURIED UNDER GROUND
Document Type and Number:
Japanese Patent JP3756077
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a structure for burying a material to be buried under ground capable of stably maintaining the state of the buried material at the time of back filling for long period without sinking and rising of the buried material and back filled material after back filling even if the ground is soft.
SOLUTION: Water permeable sheets 11 are laid down along grooves 10 dug for burying the buried material under ground, and a foundation 12, buried material 20, back filling soil 13, and foam resin blocks are buried from the upper side of the sheet. Then, all of them are packed by the water permeable sheets 11. Finishing operation is performed from the upper side of the packing water permeable sheets 11.
Inventors:
Osamu Sato
Koji Watanabe
Kenji Takahashi
Koji Watanabe
Kenji Takahashi
Application Number:
JP2001123247A
Publication Date:
March 15, 2006
Filing Date:
April 20, 2001
Export Citation:
Assignee:
Sekisui Plastics Co., Ltd.
International Classes:
E02B9/06; E02D3/00; E02D31/10; E02F5/10; E03F3/06; F16L1/024; F16L1/038; (IPC1-7): E02B9/06; E02D3/00; E02D31/10; E02F5/10; E03F3/06; F16L1/024; F16L1/038
Domestic Patent References:
| JP2232429A | ||||
| JP5140907A | ||||
| JP10131158A | ||||
| JP11117273A |
Attorney, Agent or Firm:
Yusuke Hiraki
Yasushi Hayakawa
Yasushi Hayakawa
Previous Patent: HEAT INSULATION WATERPROOF STRUCTURE OF ROOF
Next Patent: METHOD AND DEVICE FOR SORTING PLASTIC BY VIBRATION
Next Patent: METHOD AND DEVICE FOR SORTING PLASTIC BY VIBRATION