Title:
METHOD OF TAKING OUT SUBSTRATE
Document Type and Number:
Japanese Patent JP3964662
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of taking out substrate by which the abnormally placed state and strain of a carrier and the abnormally driven state of a detecting device can be detected and a substrate can be held normally by means of a take-out and housing arm.
SOLUTION: This method of taking out substrate includes a standard mapping step of detecting the position of each standard substrate housed in each standard slot made in a standard carrier by deciding or detecting the thickness and pitch of the standard substrate, and a substrate-to-be-treated mapping step of detecting the thickness, pitch, and position of a substrate to be treated housed in each slot made in a carrier. This method also includes a comparing and discriminating step of comparing the thickness and pitch of each standard substrate decided or detected in the standard mapping step with the thickness, pitch, and position of the substrate to be treated detected in the substrate-to-be- treated mapping step, and discriminating the taking-out of a substrate to be treated in accordance with the results of the comparison.
Inventors:
Masahiro Yoshida
Shinichiro Araki
Namba Kazen
Shinichiro Araki
Namba Kazen
Application Number:
JP2001368596A
Publication Date:
August 22, 2007
Filing Date:
December 03, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B25J13/08; H01L21/677; H01L21/027; H01L21/68; (IPC1-7): H01L21/68; B25J13/08; H01L21/027
Domestic Patent References:
| JP4107841A | ||||
| JP1315156A | ||||
| JP11106043A | ||||
| JP10050796A | ||||
| JP7005079A | ||||
| JP5041442A | ||||
| JP10303269A |
Attorney, Agent or Firm:
Koji Hagiwara
Tetsuo Kanamoto
Miaki Kametani
Tetsuo Kanamoto
Miaki Kametani
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