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Patent Searching and Data


Title:
METHOD OF THICKNENING MOLDING RESIN MATERIAL
Document Type and Number:
Japanese Patent JPH06228320
Kind Code:
A
Abstract:

PURPOSE: To thicken sufficiently an SMC or BMC composition containing an unsaturated polyester resin within a short time.

CONSTITUTION: A resin mixture containing an unsaturated polyester resin, a shrinkage lowering agent, an internal mold release and glass balloons with an alkaline earth metal oxide and/or an alkaline earth metal hydroxide is thickened by adding 0.5-5wt.%, based on the glass balloons, silicate to the system.


Inventors:
TANABE KIYOSHI
OKAFUJI YASUO
Application Number:
JP3943393A
Publication Date:
August 16, 1994
Filing Date:
February 03, 1993
Export Citation:
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Assignee:
TOKAI KOGYO CO LTD
ASAHI GLASS CO LTD
International Classes:
C08J3/00; (IPC1-7): C08J3/00
Attorney, Agent or Firm:
Kenji Izumina