Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR TREATING SILICON WAFER
Document Type and Number:
Japanese Patent JP2000331966
Kind Code:
A
Abstract:

To avoid deterioration of working efficiency and working environment dnue to the mask for sandblast treatment by applying adhesive sheets with a specific pattern onto a silicon wafer and performing a sandblast treatment to the wafer with the adhesive sheets as a mask for machining into a prescribed pattern.

Adhesive sheets 5 with a prescribed pattern are applied onto a silicon wafer 1, that is fixed to a pedestal 3 by pressing the adhesive sheets 5 with a prescribed pattern that are provided at a mold release sheet 6 that is made of a plastic film or the like whose surface is coated with, for example, silicone and are supplied at a fixed speed onto the silicon wafer 1 for transferring using an application roller 7. The adhesive sheets 5 should have sufficient adhesion force for the silicon wafer 1, and various kinds of acryl and rubber adhesives are used.


Inventors:
YAMAMOTO MASAYUKI
MIKI KAZUYUKI
NAMIKAWA AKIRA
AMETANI MINORU
Application Number:
JP14243899A
Publication Date:
November 30, 2000
Filing Date:
May 21, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NITTO DENKO CORP
International Classes:
H01L21/304; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Ogi