Title:
METHOD FOR TREATING SUBSTRATE
Document Type and Number:
Japanese Patent JP2022098040
Kind Code:
A
Abstract:
To promptly precoat the inside of a chamber while suppressing the generation of particles.SOLUTION: A method for treating a substrate comprises steps of (a) forming a precoat film on parts arranged in a chamber and (b) treating one or more substrates after the step (a). The step (a) includes (a1) forming a first film on the parts in the chamber without using plasma or using first plasma formed on conditions capable of suppressing the sputtering of the parts in the chamber and (a2) forming a second film on the surface of the first film using second plasma.SELECTED DRAWING: Figure 3
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Inventors:
KUMAKURA SHO
NAKANE YUTA
NAKANE YUTA
Application Number:
JP2020211353A
Publication Date:
July 01, 2022
Filing Date:
December 21, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
C23C16/44; H01L21/3065
Attorney, Agent or Firm:
Sakai International Patent Office
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