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Title:
METHOD FOR TREATING WOODY MATERIAL SUCH AS CHIP
Document Type and Number:
Japanese Patent JP3178752
Kind Code:
B2
Abstract:

PURPOSE: To eliminate a low yield of a component constituting pulp.
CONSTITUTION: A solvent solution of a chlorine-based vapor defatting and washing organic solvent is heated, boiled and vaporized in operation to treat a woody material and the resultant gas of the chlorine-based vapor defatting and washing organic solvent is permeated into the woody material to melt fats and oils therein. Thereby, holes are bored in the cell membrane of the woody material. Water is further added to a solvent solution (B) of the chlorine- based vapor defatting and washing organic solvent and the obtained mixture is heated to about 100-130°C to permeate the vapor of the chlorine-based vapor defatting and washing organic solvent and steam into the woody material to melt the fats and oils in the woody material. Thereby, holes are bored in the cell membrane of the woody material. Furthermore, the woody material and the chlorine-based vapor defatting and washing organic solvent (B) are hermetically sealed in a pressure container (A) to repeatedly carry out the heating and pressurizing and cooling and decompressing. As a result, the melting of the fat and oil components in the woody material is accelerated with the chlorine-based vapor defatting and washing organic solvent (B).


Inventors:
Yotaro Hashimoto
Application Number:
JP2813293A
Publication Date:
June 25, 2001
Filing Date:
February 17, 1993
Export Citation:
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Assignee:
Eiwa Co., Ltd.
International Classes:
C02F1/26; B27K5/00; D21C1/00; (IPC1-7): D21C1/00
Domestic Patent References:
JP6269893A
JP61160492A
JP521002A
JP5729402A
JP6137757A
Attorney, Agent or Firm:
Juichiro Yano



 
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