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Title:
METHOD FOR WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES
Document Type and Number:
Japanese Patent JP2016105513
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for attaching a shape memory alloy wire to a substrate.SOLUTION: The wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.SELECTED DRAWING: None

Inventors:
STEFAN BRAUN
FRANK NIKLAUS
ANDREAS FISCHER
HENRIK GRADIN
Application Number:
JP2016039342A
Publication Date:
June 09, 2016
Filing Date:
March 01, 2016
Export Citation:
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Assignee:
SENSEAIR AB
International Classes:
H01L21/60
Domestic Patent References:
JP2014502422A2014-01-30
JP2001291736A2001-10-19
Foreign References:
US6478212B12002-11-12
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Atsushi Honda



 
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