Title:
エレクトレット振動板を製造するための方法
Document Type and Number:
Japanese Patent JP4903850
Kind Code:
B2
Abstract:
A method for manufacturing electret diaphragms is provided. First, a dielectric film is attached to a frame by an adhesive material and a fastening element grips the peripheral area of the dielectric film on the frame. Afterward, the dielectric film is subjected to a metal sputtering process to form a conductive material layer thereon, Finally, the dielectric film is subjected to a polarizing process thereby forming an electret diaphragm.
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Inventors:
Lee, Fan Ching
Application Number:
JP2009244104A
Publication Date:
March 28, 2012
Filing Date:
October 23, 2009
Export Citation:
Assignee:
HTC Corporation
International Classes:
H04R31/00; H04R19/01
Domestic Patent References:
| JP2008147899A | ||||
| JP2005094384A | ||||
| JP2008172413A | ||||
| JP2005151026A | ||||
| JP2008042436A |
Attorney, Agent or Firm:
Ryoichi Takaoka