Title:
金属製造プロセス用の型板における温度分布を特定するための方法およびデバイス
Document Type and Number:
Japanese Patent JP6688942
Kind Code:
B2
Abstract:
The present disclosure relates to a method of determining a temperature distribution in a mould plate of a mould for a metal-making process, wherein the method comprises: obtaining (S 1 ) a temperature value from each of a plurality of temperature sensors arranged in the mould plate, each temperature sensor being spaced apart from a respective reference point in the mould plate, determining (S 2 ) for each temperature value a reference point temperature value at the corresponding reference point using a respective function describing a temperature relationship between the temperature value obtained from a temperature sensor and an estimated temperature at the corresponding reference point, and obtaining (S 3 ) an estimated temperature distribution at the reference points in the mould plate by means of the reference point temperature values.
Inventors:
Martin, Sedeen
Application Number:
JP2019551930A
Publication Date:
April 28, 2020
Filing Date:
March 12, 2018
Export Citation:
Assignee:
ABB Schweiz AG
International Classes:
G01K13/00; G01K7/42; G01K11/32
Domestic Patent References:
| JP2007167871A | ||||
| JP2016198786A |
Foreign References:
| WO2015115651A1 | ||||
| WO2017032392A1 | ||||
| US20110144790 |
Attorney, Agent or Firm:
Sonoda/Kobayashi Patent Business Corporation