Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
細粉砕した固体をコーティングするための方法及び装置
Document Type and Number:
Japanese Patent JP2006509627
Kind Code:
A
Abstract:
The present invention relates to a fine milling device suitable for applying a liquid to a solid that is to be finely milled comprising a milling zone for finely milling said solid; means (103,105) for introducing said solid to said milling zone; a nozzle (107) for introducing said liquid as a finely divided liquid into said milling zone either separately during the milling operation or simultaneously with said solid that is to be finely milled; a regulating unit (118) for controlling the ratio of said solid to said liquid; and means (113) for discharging product.

Inventors:
Hauk, Gerhard
Application Number:
JP2004560411A
Publication Date:
March 23, 2006
Filing Date:
December 15, 2003
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Syngenta Partitions Akchen Gesell Shaft
International Classes:
B02C21/00; A01N25/26; A01N51/00; B01J2/00; B02C13/00; B02C19/06; B02C23/08; B02C23/18; B02C23/28; B02C23/34
Domestic Patent References:
JP2002538279A2002-11-12
JPS50160350A1975-12-25
JPS6127104B21986-06-24
Foreign References:
EP2080558A12009-07-22
US3186648A1965-06-01
US3411480A1968-11-19
GB1253067A1971-11-10
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Fukumoto product
Tetsuji Koga
Ayako Okamura
Masaya Nishiyama