Title:
電子部品をコンディショニングガスでカプセル封入する方法および装置
Document Type and Number:
Japanese Patent JP4874967
Kind Code:
B2
Abstract:
Electronic components in mold are encapsulated by introducing a part of the conditioning gas into the mold cavity during release of the encapsulating material from the mold cavity such that a releasing gas pressure is exerted on the encapsulating material by the conditioning gas. Encapsulation of electronic components in mold comprises placing the electronic component for encapsulating in a mold cavity, and feeding an encapsulating material to the mold cavity. A part of the mold surface defines the mold cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. A part of the conditioning gas is introduced into the mold cavity during release of the encapsulating material from the mold cavity such that a releasing gas pressure is exerted on the encapsulating material by the conditioning gas. An independent claim is also included for a device (1) for encapsulating an electronic component (12), in particular a semiconductor, with encapsulating material, comprising at least two co-acting mold parts (2, 3) which are mutually displaceable between a molding position, in which the mold parts take up a position for defining at least one mold cavity (4) receiving the electronic component, and an opened position in which the mold parts are situated at a greater distance from each other than in the encapsulating position. A feed mechanism is provided for encapsulating material (5) connecting to the mold cavity. A supply mechanism is provided for a conditioning gas with a decreased oxygen concentration relative to the atmosphere. It is connected to a contact side of at least one of the mold parts.
Inventors:
Peters, Henrix, Johannes, Bernardas
Reymel, Arthur, Theodorus, Johannes
Defleece, Franciscus, Bernardas, Antonius
Venroy, Johannes, Lamberts, Gerados, Maria
Reymel, Arthur, Theodorus, Johannes
Defleece, Franciscus, Bernardas, Antonius
Venroy, Johannes, Lamberts, Gerados, Maria
Application Number:
JP2007521421A
Publication Date:
February 15, 2012
Filing Date:
July 14, 2005
Export Citation:
Assignee:
Phico B. buoy.
International Classes:
B29C45/43; B29C33/70; B29C39/42; B29C45/14; B29C45/26; B29C33/10; B29C33/58; B29C33/60; B29C45/02
Domestic Patent References:
| JPS59140019A | 1984-08-11 | |||
| JP2000263603A | 2000-09-26 | |||
| JP2000280298A | 2000-10-10 | |||
| JP2002187175A | 2002-07-02 | |||
| JPH02156644A | 1990-06-15 | |||
| JPH09314619A | 1997-12-09 |
Attorney, Agent or Firm:
Masago Onishi