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Title:
プロセス材料を配合するための方法および装置
Document Type and Number:
Japanese Patent JP2005533639
Kind Code:
A
Abstract:
A method and apparatus for blending and supplying process materials. The method and apparatus are particularly applicable to the blending of ultra-high purity chemicals, the blending of abrasive slurries with other chemicals for the polishing of semiconductor wafers, and high-accuracy blending of chemicals.

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Inventors:
Willmar, Jeff, A.
Macalister, Bryan, Alan
Swan, Daniel, A.
Sittard, David, E.
Application Number:
JP2004523155A
Publication Date:
November 10, 2005
Filing Date:
July 18, 2003
Export Citation:
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Assignee:
Kinetic Systems, Incorporated
International Classes:
B01F23/00; G05D11/13; (IPC1-7): B01F15/04; B01F5/10
Domestic Patent References:
JP2000157858A2000-06-13
JPH04218164A1992-08-07
Foreign References:
US4764019A1988-08-16
WO2002009859A22002-02-07
Attorney, Agent or Firm:
Kiyoji Kuzuwa



 
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