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Patent Searching and Data


Title:
チップカードを製造するための方法及び装置
Document Type and Number:
Japanese Patent JP4439519
Kind Code:
B2
Abstract:
The invention relates to a method and a device for producing chip cards comprising a first component, e.g. a chip module provided with a first contact surface, and a second component, e.g. an antenna provided with a second contact surface, the two contact surfaces being connected to an electroconductive mass. In a first step, the card body (1) is bent by means of a bending device in such a way that it has a curve in the form thereof, and the mass (4) applied in a recess (5) of the card body (1) for subsequently receiving the first component (2) is arranged on the outer side of the curve. In a second step, at least one light beam (7) from a light source (6) is laterally oriented towards the applied mass (4) in order to measure an application height (4a) of the electroconductive mass (4) in relation to the card body (1) by optically imaging the application height (4a).

Inventors:
Brand Le Franz
Rakha Danau Shalhey
Plaka Penka Vladimir
Application Number:
JP2006523552A
Publication Date:
March 24, 2010
Filing Date:
July 24, 2004
Export Citation:
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Assignee:
Muehlbauer AG
International Classes:
B42D15/10; G01B11/02; G06K19/077
Domestic Patent References:
JP2002505022A
JP2004179458A
JP2001298269A
Foreign References:
WO1999021131A1
Attorney, Agent or Firm:
Eiji Saegusa
Kakehi Yuro
Yata Ryuichi
Tachibana Kenji