Title:
プロセス材料を混合する方法及び装置
Document Type and Number:
Japanese Patent JP5008815
Kind Code:
B2
Abstract:
A method and apparatus for blending and supplying process materials. The method and apparatus are particularly applicable to the blending of ultra-high purity chemicals, the blending of abrasive slurries with other chemicals for the polishing of semiconductor wafers, and high-accuracy blending of chemicals. The apparatus may include a dispensing subsystem that supplies process materials to a mixing subsystem where they are blended with a static mixer. The method may include supplying process materials with a dispensing subsystem and blending the process materials in a static mixer.
Inventors:
Willmar, Jeffrey Alexander
Mackenzie, Daniel Case
Lulu, John Michael
The Dai, Eric A
Walker, Michael El
Mackenzie, Daniel Case
Lulu, John Michael
The Dai, Eric A
Walker, Michael El
Application Number:
JP2002515403A
Publication Date:
August 22, 2012
Filing Date:
July 31, 2001
Export Citation:
Assignee:
Celerity Incorporated
International Classes:
B01F3/08; B01F5/00; B01F5/04; B01F5/06; B01F15/04; G05D11/13
Domestic Patent References:
| JP57021024U | ||||
| JP2000354729A | ||||
| JP2000158343A | ||||
| JP11207604A | ||||
| JP10118899A | ||||
| JP8118232A | ||||
| JP5309376A | ||||
| JP54088878A |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tadashi Masui
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Tadashi Masui