Title:
被加工材の露光後ベーク処理のための方法および装置
Document Type and Number:
Japanese Patent JP7086232
Kind Code:
B2
Abstract:
Post exposure bake methods are provided. In one example, a method includes placing a workpiece having a photoresist layer on a workpiece support disposed in a processing chamber. The method includes exposing the photoresist to photons of a wavelength through a photomask. The method includes performing a post exposure bake heating process on the workpiece with the photoresist heating layer. The post exposure bake heating process can include heating the workpiece with both a radiant heat source and a second heat source disposed in the workpiece support until a temperature of the workpiece reaches a post exposure bake setpoint temperature.
Inventors:
Michael X. Yang
Application Number:
JP2020569815A
Publication Date:
June 17, 2022
Filing Date:
May 03, 2019
Export Citation:
Assignee:
Mattson Technology, Inc.
Beijing E-Town Semiconductor Technology Co., Ltd.
Beijing E-Town Semiconductor Technology Co., Ltd.
International Classes:
H01L21/027; G03F7/38
Domestic Patent References:
| JP2014220471A | ||||
| JP2000146444A | ||||
| JP2017525131A | ||||
| JP2018164076A | ||||
| JP2002525845A | ||||
| JP58075154A | ||||
| JP2013069990A | ||||
| JP2002023860A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Taku Morita
Junichi Maekawa
Hideo Nagashima
Hiroyasu Ninomiya
Ueshima class
Taku Morita
Junichi Maekawa
Hideo Nagashima
Hiroyasu Ninomiya
Ueshima class