Title:
地盤沈下量を予測するための方法、プログラム、及びシステム
Document Type and Number:
Japanese Patent JP7369960
Kind Code:
B2
Abstract:
To provide a method, a program, and a system for predicting a ground settlement amount allowing a ground settlement amount to be predicted simply and accurately.SOLUTION: A method for predicting a ground settlement amount includes: a stress applying step of applying shear stress on a soil sample; a yield strain acquiring step of acquiring yield strain, which is shear strain at a boundary of a first state and a second state when the soil sample transits from the first state where the soil sample is elastically deformed to the second state where the soil sample is non-elastically deformed; and a ground settlement amount prediction step of predicting a settlement amount of the ground of the soil sample using the yield strain.SELECTED DRAWING: Figure 13
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Inventors:
Takafumi Yoshii
Shinji Tanaka
Tomonori Muroya
Shunji Yunoki
Shinji Tanaka
Tomonori Muroya
Shunji Yunoki
Application Number:
JP2019149493A
Publication Date:
October 27, 2023
Filing Date:
August 16, 2019
Export Citation:
Assignee:
Japan Home Shield Co., Ltd.
Daiwa Basic Design Co., Ltd.
Tokyo Metropolitan Industrial Technology Research Center
Daiwa Basic Design Co., Ltd.
Tokyo Metropolitan Industrial Technology Research Center
International Classes:
E02D1/02; G01N3/00
Domestic Patent References:
| JP2003278171A | ||||
| JP2008138514A | ||||
| JP2000302525A | ||||
| JP2016028225A | ||||
| JP2018003346A |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito