Title:
超過研磨時間および/または最終研磨工程の研磨時間を計算することによって、基板の化学機械研磨(CMP)を制御する方法およびシステム
Document Type and Number:
Japanese Patent JP4740540
Kind Code:
B2
Abstract:
A method and a controller for the chemical mechanical polishing (CMP) of substrates and, in particular, for the chemical mechanical polishing of metallization layers is disclosed. In a linear model of the CMP process, the erosion of the metallization layer to be treated is determined by the overpolish time and possibly by an extra polish time on a separate polishing platen for polishing the dielectric layer, wherein the CMP inherent characteristics are represented by sensitivity parameters derived empirically. Moreover, the control operation is designed so that even with a certain inaccuracy of the sensitivity parameters due to subtle process variations, a reasonable controller response is obtained.
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Inventors:
Dark Bolstein
Jean Levigel
Geld Marxsen
Jean Levigel
Geld Marxsen
Application Number:
JP2003571039A
Publication Date:
August 03, 2011
Filing Date:
December 20, 2002
Export Citation:
Assignee:
ADVANCED MICRO DEVICES INCORPORATED
International Classes:
B24B51/00; H01L21/304; B24B37/04; B24B49/03
Domestic Patent References:
| JP11345792A | ||||
| JP2001298008A | ||||
| JP2001257187A | ||||
| JP2000310512A | ||||
| JP2000117623A | ||||
| JP2001501545A | ||||
| JP2001523586A |
Foreign References:
| WO2000000874A1 |
Attorney, Agent or Firm:
Yuji Hayakawa
Masataka Ota
Keisuke Murasame
Ryota Sano
Masataka Ota
Keisuke Murasame
Ryota Sano