Title:
真空下の半導体処理システムにおいて加工中の製品を処理する方法及びシステム
Document Type and Number:
Japanese Patent JP5226215
Kind Code:
B2
Abstract:
A substrate transport apparatus having a drive section, an articulated arm operably connected to the drive section, and an end effector connected to the articulated arm, the end effector being configured for holding a substrate thereon and transporting the substrate through articulation of the articulated arm. The end effector is a substantially flat and elongated member, depending from the articulated arm at a base end of the end effector, and extending longitudinally so that the end effector engages edges of the substrate on both proximal and distal sides with respect to the base end. The end effector has a lateral cross section that tapers in a longitudinal portion of the end effector extending between the base end and a distal end of the end effector, the lateral cross section being tapered, along the longitudinal portion, in at least two different directions that are angled and crossing each other.
Inventors:
Van der Murren, Peter
Application Number:
JP2006539863A
Publication Date:
July 03, 2013
Filing Date:
November 10, 2004
Export Citation:
Assignee:
Brooks Automation Incorporated
International Classes:
H01L21/677; B25J17/00; B65G1/00; B66C1/00; F26B5/04; F26B13/30; G06F7/00; G06F19/00; H01L21/00; C23C16/54; H01L
Domestic Patent References:
| JP536813A | ||||
| JP7099224A | ||||
| JP6338555A | ||||
| JP2000177842A | ||||
| JP7211762A |
Attorney, Agent or Firm:
Motohiko Fujimura
Shigeyuki Nagaoka
Shigeyuki Nagaoka