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Title:
MIC CIRCUIT
Document Type and Number:
Japanese Patent JPS6030201
Kind Code:
A
Abstract:

PURPOSE: To adhere a small metallic piece and a dielectric piece tightly, and to make a fine adjustment in a high frequency band by treating the surface of the dielectric substrate of an MIC circuit chemically.

CONSTITUTION: A conductor pattern 2 on the dielectric substrate 1 which uses, for example, "Teflon" as substrate material is formed by an etching treatment as to a parallel couple type filter, and then the surface 4 of the substrate 1 is treated chemially by sodium etching to realize an MIC circuit. The bottom is a grounding conductor 3. The MIC circuit allows a metallic piece and a dielectric piece to be adhered tightly and easily to the surface because the surface of the substrate 1 is treated by the sodium etching. Therefore, when an adjusting piece is adhered, it is fixed easily even if it is small, so a fine adjustment is made and the circuit is used stably even in a higher frequency band.


Inventors:
TAKAHASHI KENJI
Application Number:
JP13898983A
Publication Date:
February 15, 1985
Filing Date:
July 29, 1983
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
H01P3/08; H01P1/203; H01P11/00; (IPC1-7): H01P3/08; H01P11/00
Attorney, Agent or Firm:
Toshi Inoguchi



 
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