Title:
MICA LAMINATION BOARD
Document Type and Number:
Japanese Patent JPS5220299
Kind Code:
A
Abstract:
PURPOSE: To provide a heat-resitant mica lamination board, which has waterproof property and provides excellent heat insulation property at the time of high relative humidity.
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Inventors:
KOTOKUMA KANSHIYOU
Application Number:
JP9645575A
Publication Date:
February 16, 1977
Filing Date:
August 07, 1975
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C04B14/20; C09J1/00; C09K3/00; H01B3/04; (IPC1-7): C09J1/00; C09K3/00; H01B3/04