PURPOSE: To raise the resonance frequency of the case and to apply a module case to a high frequency band by providing a sectioning means in the enclosure.
CONSTITUTION: Two projecting parts 3 and 3' are provided on the internal surface of a cover 2. It is preferable for these projecting parts 3 and 3' to be provided matched with the shape of a micro-wave and millimeter wave circuit substrate which is adhered and fixed on a base stand 10. Then, these parts are provided matched with the positions of semiconductor elements 5 and 5' of the base stand 10. It is also satisfactory to provide this projecting part in many more places as needed according to the frequency of a signal to be used and the size, etc., of a micro-wave and millimeter wave module. In such a module case, when an internal space is divided by some means, the side length of each divided part can be reduced. Thus, the resonance frequency of the module case rises up and the module case can be used with much higher frequency.
OKUBO HISAFUMI
KURODA OSAMU
| JPS632406A | 1988-01-07 | |||
| JPS5310948A | 1978-01-31 |