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Patent Searching and Data


Title:
MICROCAPSULE AND HEAT TRANSFER FLUID
Document Type and Number:
Japanese Patent JP2006016573
Kind Code:
A
Abstract:

To obtain a heat transfer fluid that increases a quantity of heat to be absorbed or released and a coefficient of thermal conductivity and a microcapsule in which a latent heat accumulating substance suitable for the heat transfer fluid is sealed.

The heat transfer fluid increases a quantity of heat to be absorbed or released and a coefficient of thermal conductivity by enlarging the quantity of heat to be absorbed or released by the heat transfer fluid by the latent heat accumulating substance that is sealed in the microcapsule and is followed by phase transition and by enlarging the macroscopic coefficient of thermal conductivity of the heat transfer fluid by adding a heat-conductive particle to a substance constituting the heat transfer fluid.


Inventors:
MORITA YOSHIYUKI
OSAWA MITSURU
NAKAGAWA HIROKI
Application Number:
JP2004198250A
Publication Date:
January 19, 2006
Filing Date:
July 05, 2004
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
C09K5/06; B01J13/02; F25D9/00; F28D20/00
Domestic Patent References:
JPH0525471A1993-02-02
JPS63217196A1988-09-09
JP2003129844A2003-05-08
JP2003221578A2003-08-08
Attorney, Agent or Firm:
Isono Dozo