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Title:
MICROGEL-CONTAINING RUBBER COMPOUND CONTAINING SULFUR- CONTAINING ORGANOSILICON COMPOUND
Document Type and Number:
Japanese Patent JP2001031798
Kind Code:
A
Abstract:

To provide a rubber compound improved in the levels of mechanical properties and abrasion resistance by compounding a rubber containing double bonds with specified amounts of a rubber gel and a sulfur-containing organosilicon compound, and if necessary rubber auxiliary agents and a filler.

This rubber compound contains 100 pts.wt. rubber (A) containing double bonds, 1-150 pts.wt. rubber gel (B), 0.2-20 pts.wt. sulfur-containing organosilicon compound (C), and if necessary, rubber auxiliary agents such as a filler (e.g. carbon black), a crosslinker, a readction accelerator, and a thermal stabilizer. Natural rubber, a styrene-butadiene rubber, a polybutadiene rubber, etc., are used as ingredient A. Ingredient B is rubber particles having particle sizes of 5-1,000 nm and prepared by crosslinking a polybutadiene rubber, polychloroprene, a nitrile rubber, or the like. Ingredient C is a compound represented by the formula such as bis(triethoxy)silylpropyldisulfone. In the formula, R1 to R3 are each a 1-20C alkoxy; and Q is a hydrocarbon chain containing 1-20 carbon atoms and 1-3 heteroatoms such as N or S atoms.


Inventors:
OBRECHT WERNER
JESKE WINFRIED
Application Number:
JP2000189524A
Publication Date:
February 06, 2001
Filing Date:
June 23, 2000
Export Citation:
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Assignee:
BAYER AG
International Classes:
B60C1/00; C08J5/00; C08K5/548; C08L19/00; C08L21/00; (IPC1-7): C08L21/00; B60C1/00; C08J5/00; C08K5/548
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)