Title:
MICROOGAP POSITIONER
Document Type and Number:
Japanese Patent JPS5483380
Kind Code:
A
Abstract:
PURPOSE:To detect the adhesive contact condition between the semiconductor wafer and the mask from the quantity of displacement of the sample on the semiconductor wafer stand, and to set the displacement of the wafer in the vertical direction on the basis of the above-mentioned detection value by using pneumatic pressure, so that matching accuracy between the wafer and the mask can be enhanced. CONSTITUTION:Moving base 7 is fitted, through steel ball 6, into the aperture which is formed at the center of support stand 5, and elevation shaft is installed inside chamber 20 of the base 7, while supporting it with disc-shaped plate springs 8 and 9. Next, wafer stand 3 which is bearing wafer 1 is mounted on the top of shaft 4; and above the wafer stand 3, mask base 5 which supports mask 2, while making it independent, is installed in the proximity of wafer 1. In this constitution, pressurized air is sent into chamber 20 to adjust the gap between wafer 1 and mask 5. At this time, the displacement in the vertical direction of shaft 4 which supports wafer stand 3 is detected by electric micrometer 11; and control circuit 12, motor 13, and pressure regulating valve 14 are actuated on the basis of signals from the micrometer 11, thereby obtaining proper matching between wafer 1 and mask 2.
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Inventors:
INAGAKI AKIRA
FUNATSU RIYUUICHI
KOMORIYA SUSUMU
FUNATSU RIYUUICHI
KOMORIYA SUSUMU
Application Number:
JP15055877A
Publication Date:
July 03, 1979
Filing Date:
December 16, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G05D3/00; H01L21/027; H01L21/68; (IPC1-7): G05D3/00; H01L21/68
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