To provide a thin microphone device and a thin acoustic device with a simplified manufacturing process.
Bare chips BC2, ICKa2 are mounted on one surface 2a of a mounting substrate 2 while bare chips BC1, ICKa1 are mounted on the other surface 2b of the mounting substrate 2. A shielding case SC1 is bonded and sealed to the other surface 2b of a module substrate 2 so as to cover a pair of the bare chips BC1, ICKa1 while a shielding case SC2 is bonded and sealed to one surface 2a of the module substrate 2 so as to cover a pair of the bare chips BC2, ICKa2. A sound hole F1 serves to communicate a cavity Ca1 with a space on the side of the one surface 2a of the module substrate 2 while a sound hole F2 serves to communicate a cavity CA2 with a space on the side of the other surface 2b of the module substrate 2.
COPYRIGHT: (C)2008,JPO&INPIT
Kita cultivation
Takeshi Yoshida
Naoki Ushiyama
Toshihiko Takahata
Arikawa Yasushi
Hiroshi Maruyama
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