Title:
マイクロフォン用パッケージおよびマイクロフォン装置
Document Type and Number:
Japanese Patent JP7118632
Kind Code:
B2
Abstract:
To provide a package for a microphone that is effective in reducing the magnetic influence between a microphone element and a semiconductor element.SOLUTION: A package 10 for a microphone comprises: a metal housing 1 that has a first top face 11 including a concave part 1a, and has an opening 1b in a frame-like part 12 surrounding the concave part 1a; a wiring board 2 that includes an insulating substrate 22 having an under surface and side faces joined to the metal housing 1 in the opening 1b and having a second top face 21 at a lower height position than that of the first top face 11 of the metal hosing 1, and a wiring conductor 23 located on an exposed surface of the insulating substrate 22; a metal layer 3 that contains a metal material having a smaller yield stress than that of the metal housing 1 as a main component, is located on the second top face 21 of the insulating substrate 22, and has a third top face 31 having the same height position as that of the first top face 11 of the metal housing 1; and a metal frame body 4 that is joined to the first top face 11 and third top face 31.SELECTED DRAWING: Figure 1
Inventors:
Yamazaki
Application Number:
JP2017240342A
Publication Date:
August 16, 2022
Filing Date:
December 15, 2017
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H04R1/02; H01L23/02; H01L25/065; H01L25/07; H01L25/18; H01L29/84; H01L41/053; H01L41/09; H04R19/04
Domestic Patent References:
| JP2013055693A | ||||
| JP2008187607A |
Foreign References:
| US20160234604 | ||||
| US20110127623 | ||||
| US20160014530 |
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune
Yoshio Arafune