Title:
マイクロプラズマ装置
Document Type and Number:
Japanese Patent JP5539650
Kind Code:
B2
Abstract:
A method of forming a microplasma device places a curable polymer material between a mold having a negative volume impression of microcavities and/or microchannels and a substrate. The polymer is cured and then the mold is separated from the solid polymer. The method can form a microplasma device that includes a substrate and either or both of a microchannel or microcavity defined in a polymer layer supported by the substrate. Electrodes arranged with respect to the polymer material can excite plasma in a discharge medium contained in the microchannel or the microcavity or both. A flexible mold is preferably used to fabricate transparent polymer microcavities onto rigid substrates. A rigid mold is preferably used to fabricate transparent polymer microcavities onto flexible substrates. Having one of the mold and the substrate flexible and the other rigid aids in the separation of the mold from the cured polymer.
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Inventors:
Eden, Gerry Jay
Park, sun-gin
Lou, Men
Park, sun-gin
Lou, Men
Application Number:
JP2008551481A
Publication Date:
July 02, 2014
Filing Date:
January 23, 2007
Export Citation:
Assignee:
The Board of Trustees of the University of Illinois
International Classes:
H05H1/24; H01J11/00; H01J17/16; H01J17/49
Domestic Patent References:
| JP2003282010A | ||||
| JP2004272199A | ||||
| JP10237197A | ||||
| JP3270045B2 | ||||
| JP2000067756A | ||||
| JP10101373A | ||||
| JP2001135241A | ||||
| JP2000231877A | ||||
| JP2005149807A |
Foreign References:
| US3767968 |
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada
Takanori Mamoru
Taiji Morikawa
Amamiya Yasuhito
Kei Sakurada