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Title:
MICROWAVE HEATING PROCESSING APPARATUS AND PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2013137967
Kind Code:
A
Abstract:

To provide a microwave heating processing apparatus and processing method which enables uniform processing of a target object with high power use efficiency and heating efficiency.

All of four microwave introduction ports 10 are arranged to deviate from directly above a wafer W such that the long sides thereof are in parallel to at least one of four straight parts of a sidewall portion 12. The top surface of a rectifying plate 23 which surrounds the wafer W is inclined so as to be widened from the side of the wafer W (inner side) toward the side of the sidewall portion 12 (outer side) to form an inclined portion 23A. The inclined portion 23A is disposed to face the four microwave introduction ports 10 in a vertical direction.


Inventors:
IKEDA TARO
TANAKA KIYOSHI
Application Number:
JP2011289025A
Publication Date:
July 11, 2013
Filing Date:
December 28, 2011
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H05B6/64; F27D11/12; H05B6/72
Domestic Patent References:
JPH11214143A1999-08-06
JPH10172751A1998-06-26
JP2011066254A2011-03-31
JP2003187957A2003-07-04
JP2008275178A2008-11-13
JP2003217818A2003-07-31
JP2005268624A2005-09-29
JPH11214143A1999-08-06
JPH10172751A1998-06-26
JP2011066254A2011-03-31
JP2003187957A2003-07-04
JP2008275178A2008-11-13
JP2003217818A2003-07-31
JP2005268624A2005-09-29
Attorney, Agent or Firm:
Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa



 
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