Title:
MICROWAVE PLASMA TREATMENT DEVICE
Document Type and Number:
Japanese Patent JPH06104210
Kind Code:
A
Abstract:
PURPOSE: To provide a microwave plasma treatment device forming a high density plasma, capable of equalizing treatment such as etching and capable of increasing the speed of plasma treatment.
CONSTITUTION: Dielectrics 15 are mounted into a treatment chamber 10 in a microwave plasma treatment device. Or the dielectrics 15 are installed into the treatment chamber 10 so as to be able to divide the inside of the treatment chamber 10. Accordingly, the density of radicals in the vicinity of a sample 17 is equalized approximately and increased when treatment such as etching is conducted to the sample 17, thus allowing treatment such as etching uniformly at high speed.
More Like This:
JP2022108026 | CONTINUOUS PROCESSING EQUIPMENT |
JP3213029 | PLASMA TREATING DEVICE FOR DISK SUBSTRATE AND ITS TREATMENT |
JPH01100264 | MOLECULAR FLOW GENERATOR |
Inventors:
FURUSE MUNEO
WATANABE SEIICHI
WATANABE SEIICHI
Application Number:
JP24958992A
Publication Date:
April 15, 1994
Filing Date:
September 18, 1992
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C23C16/50; C23C16/511; C23F4/00; H01L21/302; H01L21/3065; (IPC1-7): H01L21/302; C23C16/50; C23F4/00
Attorney, Agent or Firm:
Yukihiko Takada
Previous Patent: A hash function generation method, a hash value generation method, a device, and a program
Next Patent: PROCESSING EQUIPMENT
Next Patent: PROCESSING EQUIPMENT