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Title:
管壁接合面を加工するフライス切削調整設備
Document Type and Number:
Japanese Patent JP6388708
Kind Code:
B2
Abstract:
A milling adjusting device for processing a pipe wall plane comprises a supporting frame (1), a top cover (2) arranged at the upper end of the supporting frame, and a transverse beam (3). The supporting frame (1) is composed of a left stand column (101) and a right stand column (102). A lifting means (4) is arranged on each of the left stand column (101) and the right stand column (102), and the transverse beam (3) is connected with the left stand column (101) and the right stand column (102) by means of the lifting means (4). The transverse beam (3) is provided with a floating beam (9) and the floating beam (9) is provided with a floating lifting mechanism (5) with milling means (6) arranged at both ends thereof. A rail car (7) is arranged at the lower ends of the milling means (6) and used to place the pipe wall of a work piece for processing a pipe die. With the adoption of the structure, the milling means (6) are arranged at both ends of the floating lifting mechanism (5) and a pressing wheel (604) is arranged at the lower end of a milling cutter (601) of the milling means, so that the size of milling can be adjusted and controlled; the pressing wheel (604) is tightly pressed on the work piece during operation and milling can be performed simultaneously; under the control of the floating lifting mechanism (5), the pressing wheel (604) and the milling cutter (601) are parallel to the floating beam (9) all the time, thereby ensuring the two planes of the work piece to be located on the same plane, and achieving the desirable roughness and flatness.

Inventors:
Chen benmin
King sentence
Shusei
Liu Lifeng
Yu Sewa
Inside
Sinking
WANG, Yunfei
Soja jade
Lee Huiquan
Kure Chun
Song Kaihua
Application Number:
JP2017505247A
Publication Date:
September 12, 2018
Filing Date:
December 16, 2014
Export Citation:
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Assignee:
JIANGSU HAI HENG BUILDING MATERIAL MACHINERY CO., LTD
International Classes:
B23C1/16; B23C1/08; B23C3/00; B23C9/00; B23Q5/26; B23Q16/00
Domestic Patent References:
JP47057742U
JP48047675A
JP49006574A
JP56033243A
JP57144644A
JP59066523U
JP1210207A
JP2004743U
JP7266115A
JP11114749A
JP2001297968A
JP2009018394A
JP2012056007A
Foreign References:
US2983199
US4357973
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito